SENTECH SIPAR: Combining PEALD and PECVD in one Reactor

SENTECH offers equipment for plasma process technology since many years. Applications can be found in the production of microchips, MEMS, Photonics, and many more. SENTECH’s flexible and highly automated plasma systems are especially suited for small and medium scale production as well as for research and development.

Especially in the last years SENTECH produced an increasing amount of cluster systems, which allow the automated combination of different processes, e.g. Plasma-Enhanced Chemical Vapor Deposition (PECVD) and Atomic Layer Deposition (ALD). The use of a cluster enables a higher throughput and the combination of processes without breaking the vacuum. The advantages of the SIPAR, which allows combining PECVD and ALD in one reactor, are similar. Moreover it is possible to switch even faster between the processes, since the substrate does not have to be moved in between. Furthermore the SIPAR is more affordable and has a smaller footprint compared to a corresponding cluster.

With SENTECH’s demo system the effectiveness of the SIPAR was shown by producing moisture barriers on organic LEDs. In total four 25 nm ALD and three 125 nm PECVD alternating Al₂O₃ layers were deposited. This led to a WVTR (water-vapor transmission rate) of only (1,2 +/- 0,7) mg/m²day, at 60°C and 90% relative humidity.

As part of the joint project PolyPhotonics the second SIPAR is currently produced and will be delivered to the Fraunhofer HHI in Berlin. Among other applications the HHI will use the SIPAR to deposit Al₂O₃ and TiO₂ layers.

Contact: sales@sentech.de