Plan Optik is driving connectivity to the next level

The progressive miniaturization, increasing integration density and requirements for more powerful signal routing create the need for 3D integration. Interposer technologies for rewiring have been developed for efficient communication with high transmission rates in the 3D chip stack or 3D system package. But currently there is no established solution to produce glass interposers that provides all the required properties for high-frequency applications.
 
Next generation interposers
 
Plan Optik has developed a new technology to produce glass wafers with an applied copper layer. These Interposers will be available in sizes up to 300 mm with hole diameters down to 100 µm (depending on wafer thickness). The wafer thickness ranges from 200 µm up to 1 mm. Plan Optiks Cu-interposers can be produced as a wafer, as panels or as boards. With a minimum hole distance equal to via diameter and a Cu-layer thickness starting from 1 µm, Cu-interposers are perfectly suitable for high-frequency applications like 5G broadband transmission, radar and imaging sensors or biosensors.

Contact: Markus Wagner, Plant Optik AG
m.wagner@planoptik.com